Advanced Metallization Conference 2007 (AMC 2007)
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Advanced Metallization Conference 2007 (AMC 2007) by Andrew J. McKerrow
Book DescriptionThe Advanced Metallization Conference - held in Albany, New York, and Tokyo, Japan - marked its 24th anniversary in 2007. These two sister conferences form a unique "one conference at two sites" that focuses on latest R&D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. Great progress has been made in ULSI metallization, but new challenges in performance, reliability and integration are expected as dimension continues to shrink. The importance of continued basic research in nanoscience and technology, using either metal wires or new materials such as carbon nanotubes, was declared key to the future of ULSI interconnects.
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Book DetailsISBN: 9781558999923
(235mm x 160mm x 43mm)
Imprint: Materials Research Society
Publisher: Materials Research Society
Publish Date: 1-Jan-2008
Country of Publication: United States
Books By Author Andrew J. McKerrow
Materials, Technology and Reliability for Advanced Interconnects 2005: Volume 863, Hardback (August 2005)
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2005.
Advanced Metallization Conference 2001 (AMC 2001), Hardback (January 2002)» View all books by Andrew J. McKerrow
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
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