Dielectric Films for Advanced Microelectronics
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Dielectric Films for Advanced Microelectronics by Mikhail R. Baklanov
Book DescriptionThe topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.
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Book DetailsISBN: 9780470013601
(249mm x 177mm x 34mm)
Publisher: John Wiley and Sons Ltd
Publish Date: 9-Feb-2007
Country of Publication: United States
Books By Author Mikhail R. Baklanov
Advanced Interconnects for ULSI Technology, Hardback (March 2012)
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects.
Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics - 2011: Volume 1335, Hardback (November 2011)» View all books by Mikhail R. Baklanov
This volume includes papers from 'Materials, Processes, and Reliability for Advanced Interconnects for Micro- and Nanoelectronics' symposium, 2011 MRS Spring Meeting.
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Author Biography - Mikhail R. Baklanov
Karen Maex, IMEC Fellow, Silicon Process and Device Technology Division, Leuven, Belgium & Professor at Katholieke Universiteit Leuven Mikhail R. Baklanov, Principal Scientist, Silicon Process and Device Technology Division, IMEC, Leuven, Belgium IMEC is the largest independent microelectronics R&D centre in Europe, with over 1250 staff. R&D ranges from the design of complex single-chip and single-package systems for telecommunications and multimedia, new process technologies for optoelectronics, photovoltaics, area-array packing, etc.
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