Temperature-fatigue Interaction by L. Remy
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Temperature-fatigue Interaction
By L. Remy

Temperature-fatigue Interaction

International Conference on Temperature-Fatigue Interaction, Paris, May 29-31 2001

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Format: Hardback

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Temperature-fatigue Interaction by L. Remy

Book Description

This volume contains a selection of peer-reviewed papers presented at the International Conference on Temperature-Fatigue Interaction, held in Paris, May 29-31, 2001, organised by the Fatigue Committee of the Societ Fran aise de M tallurgie et de Mat riaux (SF2M), under the auspices of the European Structural Integrity Society. The conference disseminated recent research results and promoting the interaction and collaboration amongst materials scientists, mechanical engineers and design engineers. Many engineering components and structures used in the automotive, aerospace, power generation and many other industries experience cyclic mechanical loads at high temperature or temperature transients causing thermally induced stresses. The increase of operating temperature and thermal mechanical loading trigger the interaction with time-dependent phenomena such as creep and environmental effects (oxidation, corrosion). A large number of metallic materials were investigated including aluminium alloys for the automotive industry, steels and cast iron for the automotive industry and materials forming, stainless steels for power plants, titanium, composites, intermetallic alloys and nickel base superalloys for aircraft industry, polymers. Important progress was observed in testing practice for high temperature behaviour, including environment and thermo-mechanical loading as well as in observation techniques. A large problem which was emphasized is to know precisely service loading cycles under non-isothermal conditions. This was considered critical for numerous thermal fatigue problems discussed in this conference.

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Book Details

ISBN: 9780080439822
ISBN-10: 0080439829
Format: Hardback
Pages: 396
Imprint: Elsevier Science Ltd
Publisher: Elsevier Science & Technology
Publish Date: 11-Mar-2002
Country of Publication: United Kingdom


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