Three-dimensional Integrated Circuit Design
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Three-dimensional Integrated Circuit Design by Vasilis F. Pavlidis
Book DescriptionWith vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. * Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers * The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find * Focuses on design issues key to the product development cycle. ..good design plays a major role in exploiting the implementation flexibilities offered in the 3-D * Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
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Book DetailsISBN: 9780123743435
(235mm x 191mm x 28mm)
Imprint: Morgan Kaufmann Publishers In
Publisher: Elsevier Science & Technology
Publish Date: 31-Oct-2008
Country of Publication: United States
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Author Biography - Vasilis F. Pavlidis
Vasileios Pavlidis is an Assistant Professor at the School of Computer Science of the University of Manchester. He did his post-doctoral research on 3D integration at the Integrated Systems Laboratory of cole polytechnique f d rale de Lausanne, and received masters and doctoral degrees from the University of Rochester, NY. In 2012 he was awarded First Prize in the Innovation Cup, a competition organized by STMicroelectronics, for an application of sensors to analyze the movement of athletes. His interests include interconnect design and analysis, IC design, and related design methodologies Eby Friedman has been with the Department of Electrical and Computer Engineering at the University of Rochester, Rochester, New York, since 1991, where he is a Distinguished Professor and Director of the High Performance VLSI/IC Design and Analysis Laboratory, and the Director of the Center for Electronic Imaging Systems. He is also a Visiting Professor at the Technion - Israel Institute of Technology. He also directs the Technion Advanced Circuits Research Center (ACRC). His current research and teaching interests are in high performance synchronous digital and mixed-signal microelectronic design and analysis with application to high speed portable processors and low power wireless communications.
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