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Description - Electronic Assembly Fabrication by Charles A. Harper

This is your step-by-step guide through the entire electronic assembly fabrication process. Electronic assemblies are the heart of all modern electronics. They house the essential chip, generate semiconductor input/output, and take care of the heat generated by the process. The explosive growth of communications and consumer electronics applications has suddenly made a knowledge of the fabrication process a very in-demand and lucrative skill. Even beginners, with no advanced degrees or mathematical backgrounds will be able to quickly and easily learn the entire electronic assembly fabrication process with this well-illustrated comprehensive tutorial.Author Charles Harper, a hands-on expert and experienced author covers the assembly process from start to finish, delving into: Chips; Boards; Solders; Packages; Interconnections; Substrates; Deposition; Cleaning; and, Coating. The latest environmental rules and constraints "Electronic Assembly Fabrication" will prove invaluable to nonspecialists and managers as well as engineers and technicians working in the development, marketing, or manufacture of electronic products, and anyone else who wants to get familiar with and profit from one of the major growth areas in the field of electronics.

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Book Details

ISBN: 9780071378826
ISBN-10: 0071378820
Format: Hardback
(231mm x 157mm x 52mm)
Pages: 672
Imprint: McGraw-Hill Professional
Publisher: McGraw-Hill Education - Europe
Publish Date: 1-Apr-2002
Country of Publication: United States

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Author Biography - Charles A. Harper

CHARLES A. HARPER is the President of Technology Seminars, Inc., an organization which provides educational training courses in electronic packaging and manufacturing to business and industry. He also had an earlier esteemed career with Westinghouse in this field. Widely recognized as one of the leaders in this industry, he has authored over a dozen highly respected books and is among the founders and past presidents of the International Microelectronics and Packaging Society (IMAPS). He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series, a widely used book series in the electronics industry. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he has also served as Adjunct Professor.

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