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Description - Hybrid Assemblies and Multichip Modules by Fred W. Kear

Providing a description of design considerations from the user's viewpoint, this detailed reference discusses the materials used in manufacturing hybrid assemblies and multichip modules - illustrating how these products are created for a wide range of applications. Examining the current state of hybrid assembly technology, "Hybrid Assemblies and Multichip Modules": provides a thorough overview of substrate materials and metals used for conductors, addressing multilayer materials and overglazes; explicates design considerations such as circuit layout, component placement, thermal management and interface problems; clarifies the manufacturing techniques used for multi-layer thick-film circuits and multilayer substrates; and explains soldering and other attachment methods for discrete components. Focusing primarily on electronic assemblies that use ceramic substrates, "Hybrid Assemblies and Multichip Modules" should serve as a comprehensive resource for manufacturing, electrical and electronics, and automotive engineers; manufacturing managers; hybrid assembly designers; hybrid assembly users; printed circuit designers, fabricators and users; and graduate-level students in manufacturing engineering and electronic packaging courses.

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Book Details

ISBN: 9780824784669
ISBN-10: 0824784669
Format: Hardback
(279mm x 216mm x 17mm)
Pages: 296
Imprint: Marcel Dekker Inc
Publisher: Taylor & Francis Inc
Publish Date: 1-Jan-1992
Country of Publication: United States

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